b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . since 1981 2006.11.15 2006.11.15 O d d a a t t a a s s h h e e e e t t device number BL-HB536A-TRE I??? bright led electronics corp. ?h? 19 ? 3 3f., no. 19, ho ping road, pan chiao city, taipei, taiwan, r. o. c. tel: 886-2-29591090 fax: 886-2-29547006/29558809 www.brtled.com . sheet date 1 2 3 4 5 6 7 contents 2006.11.15 1.0 1.0 1.0 1.0 1.0 1 .0 1.0 original released approved drawer
b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - h h b b 5 5 3 3 6 6 a a - - t t r r e e since 1981 features: package dimensions: 1. emitted color : super blue 2. lens appearance : water clear 3. mono-color type. 4. 1.6x0.8x0.6mm(06 03) standard package 5. suitable for all smt assembly methods. 6. compatible with infrared and vapor phase reflow solder process. 7. compatible with automatic placement equipment. 8. this product doesn?t contain restriction substance, comply rohs standard. applications: 1. automotive: dashboards, stop lamps, turn signals. 2. backlighting: lcds, key pads advertising. 3. status indicators: comsumer & industrial electronics. 4. general use. absolute maximum ratings(ta=25 ) parameter symbol rating unit power dissipation pd 120 mw forward current i f 30 ma peak forward current 1 i fp 100 ma reverse volage v r 5 v operating temperature topr -25 ~80 - storage temperature tstg -30 ~85 - soldering temperature tsol see page 6 - 1 condition for ifp is pulse of 1/10 duty and 0.1msec width. notes: 1.all dimensions are in millimeters (inches). 2.tolerance is 0.10mm (0.004 ?) unless otherwise specified. 3.specifications are subject to change without notice. ver.1.0 page 1 of 7
b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - h h b b 5 5 3 3 6 6 a a - - t t r r e e since 1981 electrical and optical characteristics(ta=25 ) parameter symbol condition min. typ. max. unit forward voltage vf i f =5ma - 2.8 3.2 v luminous intensity iv i f =5ma 8.2 20 - mcd reverse current i r v r =5v - - 1 a peak wave length p i f =5ma - 470 - nm dominant wave length d i f =5ma 470 - 475 nm spectral line half-width ? i f =5ma - 30 - nm veiwing angle 2 1/2 i f =5ma - 120 - deg typical electro-optical characteristics curves relative radiant intensity relative luminous intensity (@20ma) 0 0.5 1.0 40 30 20 10 forward current (ma) 50 relative luminous intensity 10 fig.5 relative luminous intensity vs. forward current 2.0 1.5 0 fig.6 radiation diagram fig.6 radiation diagram forward voltage(v) 2 14 35 ambient temperature ta( c) a -40 0 0 -20 0.5 40 20 60 fig.3 forward current vs. forward voltage forward current (ma) 20 30 40 50 1.5 (normalized @ 20ma) 1.0 2.0 ambient temperature 2.5 3.0 fig.4 relative luminous intensity vs. relative radiant intensity 0 420 0.5 wavelength (nm) 470 520 ambient temperature ta( c) 0 40 20 80 60 100 10 10 20 40 30 50 1.0 fig.1 relative intensity vs. wavelength fig.2 forward current derating curve vs. ambient temperature 60 0.5 0.7 0.8 0.3 0.1 0.2 0.4 10 20 0 0.9 1.0 90 0.6 80 60 70 50 40 30 ver.1.0 page 2 of 7
b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - h h b b 5 5 3 3 6 6 a a - - t t r r e e since 1981 tapping and packaging speci fications(units: mm) package method(unit: mm)vacuum 220 245 470 aluminum foil bag 220 645 210 185 6 box/carton bar code label 3000 pcs/reel 12 bag/box 200 ver.1.0 page 3 of 7
b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - h h b b 5 5 3 3 6 6 a a - - t t r r e e since 1981 bin limits intensity bin limits (at 5ma) bin code min. (mcd) max. (mcd) j 8.2 12.3 k 12.3 18.5 l 18.5 28.0 m 28.0 42.0 tolerance for each bin limit is 15%. color bin limits (at 5ma) bin code min. (nm) max. (nm) 5 470 475 tolerance for each bin limit is 1nm. v f bin limits (at 5ma) bin code min.(v) max.(v) e 2.4 2.6 f 2.6 2.8 g 2.8 3.0 h 3.0 3.2 tolerance for each bin limit is 0.05v. bin x x x v f bin code color bin code intensity bin code ver.1.0 page 4 of 7
b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - h h b b 5 5 3 3 6 6 a a - - t t r r e e since 1981 reliability test classification test item reference standard test conditions result operation life mil-std-750:1026 mil-std-883:1005 jis-c-7021 :b-1 connect with a power if=20ma ta=under room temperature test time=1,000hrs 0/20 high temperature high humidity storage mil-std-202:103b jis-c-7021 :b-11 ta=+65 5 rh=90%-95% test time=240hrs 0/20 high temperature storage mil-std-883:1008 jis-c-7021 :b-10 high ta=+85 5 test time=1,000hrs 0/20 endurance te s t low temperature storage jis-c-7021 :b-12 low ta=-35 5 test time=1,000hrs 0/20 temperature cycling mil-std-202:107d mil-std-750:1051 mil-std-883:1010 jis-c-7021 :a-4 -35 ~ +25 ~ +85 ~ +25 60min 20min 60min 20min test time=5cycle 0/20 thermal shock mil-std-202:107d mil-std-750:1051 mil-std-883:1011 -35 5 ~+85 5 20min 20min te s t ti m e = 1 0 c y c l e 0/20 environmental te s t solder resistance mil-std-202:201a mil-std-750:2031 jis-c-7021 :a-1 preheating 140 -160 ,within 2 minutes. operation heating 260 (max.), within 10seconds. (max.) 0/20 judgment criteria of failure for the reliability measuring items symbol measuring conditions judgement criteria for failure forward voltage v f ( v) i f =20ma over ux1.2 reverse current i r (ua) v r =5v over ux2 luminous intensity iv ( mcd ) i f =20ma below sx0.5 note: 1.u means the upper limit of specified characteristics. s means initial value. 2.measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. ver.1.0 page 5 of 7
b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - h h b b 5 5 3 3 6 6 a a - - t t r r e e since 1981 soldering : 1. manual of soldering the temperature of the iron tip should not be higher than 300 (572 H ) and soldering within 3 seconds per solder-land is to be observed. 2. reflow soldering preheating : 140 ~160 5 ,within 2 minutes. operation heating : 260 (max.) within 10 seconds.(max) gradual cooling (avoid quenching). 3. dip soldering (wave soldering) : preheating : 120 ~150 ,within 120~180 sec. operation heating : 245 5 within 5 sec.260 (max) gradual cooling (avoid quenching). handling : care must be taken not to cause to the epoxy resin portion of bright leds while it is exposed to high temperature. care must be taken not rub the epoxy resin portion of bright leds with hard or sharp article such as the sand blast and the metal hook . temperature time over 2 min. 4 /sec. max. 4 /sec. max. 10 sec. max. 260 max. 140~160 temperature time 120~180 sec. preheat 245 5 within 5 sec. soldering heat max. 260 120~150 ver.1.0 page 6 of 7
b b r r i i g g h h t t l l e e d d e e l l e e c c t t r r o o n n i i c c s s c c o o r r p p . . b b l l - - h h b b 5 5 3 3 6 6 a a - - t t r r e e since 1981 notes for designing: care must be taken to provide the current limiting resistor in the circuit so as to drive the bright leds within the rated figures. also, caution should be taken not to overload bright leds with instantaneous voltage at the turning on and off of the circuit. when using the pulse drive care must be taken to keep the average current within the rated figures. also, the circuit should be designed so as be subjected to reverse voltage when turning off the bright leds. storage: in order to avoid the absorption of moisture, it is recommended to solder bright leds as soon as possible after unpacking the sealed envelope. if the envelope is still packed, to store it in the environment as following: (1) temperature : 5 -30 (41 H )humidity : rh 60 max. (2) after this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. completed within 24 hours. b. stored at less than 30% rh. (3) devices require baking before mounting, if: (2) a or (2) b is not met. (4) if baking is required, devices must be baked under below conditions: 12 hours at 60 3 . package and label of products: (1) package: products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on each bag. (2) label: bright led logo part no. quantity bin. sealing date x xx xx xx year month day manufacture location ver.1.0 page 7 of 7
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